KIOXIA BG7 Series SSDs: BiCS FLASH Gen 8 Comes to Client PCs

What KIOXIA announced

KIOXIA introduced the BG7 Series as its next generation, value oriented client SSD line for PC OEMs. The headline upgrade is the move
to BiCS FLASH generation 8 3D flash memory, paired with CBA (CMOS directly Bonded to Array) technology. The company says this combo
improves both throughput and power efficiency for everyday client workloads in commercial and consumer systems.

At a glance

• Interface: PCIe 4.0 (Gen4 x4)
• Protocol: NVMe 2.0d
• Form factors: M.2 2230, 2242, 2280 (single sided options)
• Capacities: 256 GB, 512 GB, 1 TB, 2 TB
• Design: DRAM-less with Host Memory Buffer (HMB)
• Security option: Self encrypting variants supporting TCG Opal 2.01

Why BiCS FLASH Gen 8 plus CBA matters

NAND generation upgrades are not just about peak speed. For client PCs, power efficiency and thermals can be just as important, especially
in small M.2 2230 or 2242 slots with limited airflow. KIOXIA’s CBA approach bonds CMOS control circuitry directly to the memory array,
shortening signal paths and reducing overhead. In practical terms, the goal is better performance per watt and better sustained behavior
under tight power envelopes.

KIOXIA also positions BG7 as an “everyday” client SSD that inherits improvements from its latest flash technology without moving the product
into a premium, high cost category.

BG7 performance and specs (from KIOXIA client SSD datasheet)

Peak performance varies by capacity. Higher capacity models typically have more NAND parallelism, which is why 1 TB and 2 TB SKUs lead on
sequential throughput.

Note: figures shown are “up to” values from KIOXIA’s client SSD datasheet. Real world results depend on platform, firmware, thermals, and workload.

Form factors and why the new 2242 option is useful

BG7 expands beyond the usual 2230 and 2280 with an M.2 2242 variant. That extra length can help OEMs route components, fit mounting points,
or meet internal layout constraints without committing to a full 2280 slot.

BG7 vs BG6: what changes for OEMs

BG6 was already a widely used Gen4, DRAM-less client SSD line. BG7 keeps the same broad philosophy but upgrades the underlying flash generation
and extends the footprint options. KIOXIA also highlights major improvements in efficiency for sequential writes, tied to CBA technology.

Note: BG7 and BG6 tables mix published “up to” throughput and company stated comparative claims. Always validate with your own platform testing.

What DRAM-less plus HMB means in real systems

BG7 is designed as a DRAM-less SSD that can use Host Memory Buffer (HMB), borrowing a small portion of system DRAM for mapping and metadata.
For OEMs, the appeal is lower SSD cost and simpler BOM without sacrificing typical client responsiveness.

The tradeoff is that performance can be more sensitive to platform memory behavior and workload mix. In most mainstream notebook scenarios,
HMB based drives perform well, but heavy sustained writes and edge cases under tight thermal limits are where SKU and firmware tuning matter most.

Availability and what to watch next

KIOXIA says BG7 will be shown publicly at CES 2026, with select PC OEM customers already evaluating samples. For most readers, the first place you
will likely encounter BG7 is inside new OEM notebook or desktop configurations rather than as a retail boxed drive.

• Short term: early OEM design wins and initial platform validation
• Mid term: systems shipping with 2230 and 2242 configurations in thin devices
• Long term: wider rollout as Gen 8 flash ramps across client portfolios